Physical Vapour Deposition (PVD) Sputtering is a physical process where a target material used as the coating is bombarded with positively charged ionized gas molecules (typically Argon) in an inert gas chamber causing atoms to be “Sputtered” off into the plasma. These vaporised atoms are then deposited when they condense as a thin film on the substrate or wafer to be coated. This is also known as PVD Thin Film Coating.

PVD is specifically used in the manufacture of materials which require thin films for Mechanical, Optical, Chemical or Electronic functions. Electrical Conductivity, Hardness, Wear and Corrosion / Oxidation Resistance of a substrate will be significantly enhanced, improving its performance efficiency in areas of applications such as:

• Decorative
• Architectural
• Optoelectronics
• Semiconductor
• Data Storage
• Photovoltaics
• Tribology

PVD Sputtering Targets and Backing Plates are provided and available in a varied range of physical mechanical designs depending on customer specific PVD processes employed. Compositions and Purities of the Sputtering Targets are allowed for customisation to fulfil specific customer requirements.